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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

74LVC573A

Octal D-type transparent latch with 5 V tolerant inputs/outputs; 3-state

The 74LVC573A is an 8-bit D-type transparent latch with 3-state outputs. The device features latch enable (LE) and output enable (OE) inputs. When LE is HIGH, data at the inputs enter the latches. In this condition the latches are transparent, a latch output will change each time its corresponding D-input changes. When LE is LOW the latches store the information that was present at the inputs a set-up time preceding the HIGH-to-LOW transition of LE. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Operation of the OE input does not affect the state of the latches. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 1.2 to 3.6 V

  • Overvoltage tolerant inputs to 5.5 V

  • CMOS low power consumption

  • Direct interface with TTL levels

  • IOFF circuitry provides partial Power-down mode operation

  • High-impedance when VCC = 0 V

  • Flow-through pinout architecture

  • Complies with JEDEC standard:

    • JESD8-7A (1.65 V to 1.95 V)

    • JESD8-5A (2.3 V to 2.7 V)

    • JESD8-C/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

參數(shù)類型

型號 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC573ABQ 1.2?-?3.6 TTL ± 24 3.4 low -40~125 79 9.5 50 DHVQFN20
74LVC573AD 1.2?-?3.6 TTL ± 24 3.4 low -40~125 85 27.6 61 SO20
74LVC573APW 1.2?-?3.6 TTL ± 24 3.4 low -40~125 101 4.7 45 TSSOP20

封裝

型號 可訂購的器件編號，（訂購碼(12NC)） 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
74LVC573ABQ 74LVC573ABQ,115
(935273507115)		 Active LVC573A SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74LVC573AD 74LVC573AD,118
(935219000118)		 Active 74LVC573AD SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74LVC573APW 74LVC573APW,118
(935219020118)		 Active LVC573A LVC573A Standard Procedure Standard Procedure SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

下表中的所有產(chǎn)品型號均已停產(chǎn) 。

型號 可訂購的器件編號，（訂購碼(12NC)） 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
74LVC573ABX 74LVC573ABXX
(935300601115)		 Obsolete LVC573A Standard procedure Standard procedure no package information
74LVC573ADB 74LVC573ADB,112
(935219010112)		 Obsolete LVC573A LVC573A Standard Procedure Standard Procedure SOT339-1
SSOP20
(SOT339-1) 		SOT339-1 SSOP-TSSOP-VSO-WAVE
暫無信息
74LVC573ADB,118
(935219010118)		 Obsolete LVC573A LVC573A Standard Procedure Standard Procedure SOT339-1_118
74LVC573APW 74LVC573APW,112
(935219020112)		 Withdrawn / End-of-life LVC573A LVC573A Standard Procedure Standard Procedure SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
暫無信息

環(huán)境信息

型號 可訂購的器件編號 化學(xué)成分 RoHS RHF指示符
74LVC573ABQ 74LVC573ABQ,115 74LVC573ABQ rohs rhf rhf
74LVC573AD 74LVC573AD,118 74LVC573AD rohs rhf rhf
74LVC573APW 74LVC573APW,118 74LVC573APW rohs rhf rhf

下表中的所有產(chǎn)品型號均已停產(chǎn) 。

型號 可訂購的器件編號 化學(xué)成分 RoHS RHF指示符
74LVC573ABX 74LVC573ABXX 74LVC573ABX rohs rhf rhf
74LVC573ADB 74LVC573ADB,112 74LVC573ADB rohs rhf rhf
74LVC573ADB 74LVC573ADB,118 74LVC573ADB rohs rhf rhf
74LVC573APW 74LVC573APW,112 74LVC573APW rohs rhf rhf
品質(zhì)及可靠性免責(zé)聲明

文檔 (18)

文件名稱 標(biāo)題 類型 日期
74LVC573A Octal D-type transparent latch with?5?V?tolerant?inputs?/?outputs; 3?-?state Data sheet 2023-09-07
AN11009 Pin FMEA for LVC family Application note 2019-01-09
AN263 Power considerations when using CMOS and BiCMOS logic devices Application note 2023-02-07
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
lvc573a lvc573a IBIS model IBIS model 2013-04-09
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT163-1 plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body Package information 2024-11-15
SOT339-1 plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body Package information 2020-04-21
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body Package information 2024-11-15
lvc lvc Spice model SPICE model 2013-05-07
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名稱 標(biāo)題 類型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
lvc573a lvc573a IBIS model IBIS model 2013-04-09
lvc lvc Spice model SPICE model 2013-05-07

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