PMEG100T10ELXD-Q

100 V, 1 A Trench Schottky barrier rectifier

Automotive qualified

Trench Schottky barrier rectifier encapsulated in a CFP2-HP (SOD323HP) power flat lead Surface-Mounted Device (SMD) plastic package.

Features and benefits

Low forward voltage
Low Q_rr and low I_RM
Low leakage current
High power capability due to clip-bonding technology
Power flat lead plastic package with exposed heatsink for optimal thermal connection
Qualified according to AEC-Q101 and recommended for use in automotive applications

Applications

High efficiency DC-to-DC conversion
Automotive LED lighting
Switch mode power supply
Freewheeling applications
Reverse polarity protection
OR-ing

參數(shù)類型

型號	Package version	Package name	Size (mm)	V_R [max] (V)	I_F(AV) per diode; [max] (A)	Nr of functions	Configuration	V_F [max] (mV)	I_R [max] (μA)	C_d [max] (pF)	Remark	Automotive qualified
PMEG100T10ELXD-Q	SOD323HP	CFP2-HP	1.3 x 2.2 x 0.68	100.0	1.0	single	single	795.0	0.5	95.0	Trench technology	Y

封裝

型號	可訂購的器件編號，（訂購碼(12NC)）	狀態(tài)	標(biāo)示	封裝	外形圖	回流焊/波峰焊	包裝
PMEG100T10ELXD-Q	PMEG100T10ELXD-QX (934662942115)	Active	2N	CFP2-HP (SOD323HP)	SOD323HP	REFLOW_BG-BD-1	SOD323HP_115

環(huán)境信息

型號	可訂購的器件編號	化學(xué)成分	RoHS	RHF指示符
PMEG100T10ELXD-Q	PMEG100T10ELXD-QX	PMEG100T10ELXD-Q

品質(zhì)及可靠性免責(zé)聲明

Series

Clip-bonded FlatPower (CFP)

文檔 (9)

文件名稱	標(biāo)題	類型	日期
PMEG100T10ELXD-Q	100 V, 1 A Trench Schottky barrier rectifier	Data sheet	2022-04-01
SOD323HP	3D model for products with SOD323HP package	Design support	2022-02-14
SOD323HP	SOD323HP: plastic surface-mounted package with solderable lead ends; 2.2 mm x 1.3 mm x 0.68 mm body	Package information	2023-08-02
SOD323HP_115	Reel pack for SMD, 7"; Q1/T1-Q2/T3 product orientation	Packing information	2021-09-07
PMEG100T10ELXD-Q_Nexperia_Product_Reliability	PMEG100T10ELXD-Q Nexperia Product Reliability	Quality document	2024-04-23
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
PMEG100T10ELXD-Q	PMEG100T10ELXD-Q SPICE model	SPICE model	2024-10-14
TN90007	Evaluation of junction temperature and thermal stacks using the virtual junction	Technical note	2024-09-02
TN90007	Evaluation of junction temperature and thermal stacks using the virtual junction	Technical note	2024-09-02

支持

如果您需要設(shè)計/技術(shù)支持，請告知我們并填寫應(yīng)答表我們會盡快回復(fù)您。

模型

文件名稱	標(biāo)題	類型	日期
PMEG100T10ELXD-Q	PMEG100T10ELXD-Q SPICE model	SPICE model	2024-10-14
SOD323HP	3D model for products with SOD323HP package	Design support	2022-02-14

訂購、定價與供貨

型號	Orderable part number	Ordering code (12NC)	狀態(tài)	包裝	Packing Quantity	在線購買
PMEG100T10ELXD-Q	PMEG100T10ELXD-QX	934662942115	Active	SOD323HP_115	4,500	訂單產(chǎn)品

樣品

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How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式數(shù)據(jù)手冊