外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT1226 | X2SON5 | plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | 2012-04-18 |
相關文檔
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| X2SON5_SOT1226_mk | plastic, thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| SOT1226 | plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | Package information | 2022-05-30 |
| SOT1226C_147 | X2SON5; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or Z Ordering code (12NC) ending 147 | Packing information | 2020-04-27 |
| SOT1226_125 | X2SON5; Reel pack for SMD, 7''; Q3/T4 product orientation | Packing information | 2020-04-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT1226 | MAR_SOT1226 Topmark | Top marking | 2013-06-03 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號 | 描述 | 快速訪問 |
|---|