外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| OL-PMCM6501FNE | WLCSP6 | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | 2015-07-20 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| OL-PMCM6501VPE | 3D model for products with OL-PMCM6501VPE package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| OL-PMCM6501FNE | wafer level chip-scale package; 6 bumps; 1.48 x 0.98 x 0.35 mm | Package information | 2020-12-14 |
| OL-PMCM6501VPE | WLCSP6: wafer level chip-size package; 6 bumps (3??x??2) | Package information | 2020-04-21 |
采用此封裝的產(chǎn)品
MOSFETs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| PMCM6501VPE | 12 V, P-channel Trench MOSFET |