74LVC1G3157-Q100
參數(shù)類型
| 型號 | Configuration | VCC (V) | RON (Ω) | Logic switching levels | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G3157GM-Q100 | SPDT | 1.65?-?5.5 | 15 | CMOS/LVTTL | very low | -40~125 | 286 | 6.3 | 142 | XSON6 |
| 74LVC1G3157GV-Q100 | SPDT | 1.65?-?5.5 | 15 | CMOS/LVTTL | very low | -40~125 | 227 | 35.5 | 141 | TSOP6 |
| 74LVC1G3157GW-Q100 | SPDT | 1.65?-?5.5 | 15 | CMOS/LVTTL | very low | -40~125 | 261 | 35.7 | 150 | TSSOP6 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G3157GM-Q100 | 74LVC1G3157GM-Q10X (935300911115) |
Active | YJ |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| 74LVC1G3157GV-Q100 | 74LVC1G3157GV-Q10H (935300244125) |
Active | YJ |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
| 74LVC1G3157GW-Q100 | 74LVC1G3157GW-Q10H (935300245125) |
Active | YJ |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G3157GM-Q100 | 74LVC1G3157GM-Q10X | 74LVC1G3157GM-Q100 |
|
|
| 74LVC1G3157GV-Q100 | 74LVC1G3157GV-Q10H | 74LVC1G3157GV-Q100 |
|
|
| 74LVC1G3157GW-Q100 | 74LVC1G3157GW-Q10H | 74LVC1G3157GW-Q100 |
|
|
文檔 (21)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC1G3157_Q100 | 10 Ohm single-pole double-throw analog switch | Data sheet | 2023-08-23 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| lvc1g3157 | 74LVC1G3157 IBIS model | IBIS model | 2016-04-27 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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