NXS0108
參數(shù)類(lèi)型
| 型號(hào) | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXS0108BQ | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.3 | 8 | low | -40~125 | 60 | 1 | 29 | DHVQFN20 | Bi-directional | AutoSense |
| NXS0108PW | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 6.3 | 8 | low | -40~125 | 93 | 2.5 | 36 | TSSOP20 | Bi-directional | AutoSense |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXS0108BQ | NXS0108BQX (935289743115) |
Active | NXS0108B |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| NXS0108PW | NXS0108PWJ (935289744118) |
Active | NXS0108 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| NXS0108BQ | NXS0108BQX | NXS0108BQ |
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| NXS0108PW | NXS0108PWJ | NXS0108PW |
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文檔 (11)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| NXS0108 | Dual supply translating transceiver; open drain; auto?direction?sensing | Data sheet | 2024-07-31 |
| AN90014 | Pin FMEA for NXS family | Application note | 2020-03-25 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| nxs0108 | NXS0108 IBIS model | IBIS model | 2020-11-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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