74CBTLVD3244
參數(shù)類型
| 型號(hào) | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74CBTLVD3244BQ | 3.0?-?3.6 | 1.8 | CMOS/LVTTL | 7 | 400 | 8 | 0.2 | very low | -40~125 | 76 | 7.3 | 47 | DHVQFN20 |
| 74CBTLVD3244PW | 3.0?-?3.6 | 1.8 | CMOS/LVTTL | 7 | 400 | 8 | 0.2 | very low | -40~125 | 99 | 4.3 | 43.4 | TSSOP20 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74CBTLVD3244BQ | 74CBTLVD3244BQ,115 (935294099115) |
Active | TLVD3244 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74CBTLVD3244PW | 74CBTLVD3244PW,118 (935294101118) |
Active | LVD3244 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74CBTLVD3244BQ | 74CBTLVD3244BQ,115 | 74CBTLVD3244BQ |
|
|
| 74CBTLVD3244PW | 74CBTLVD3244PW,118 | 74CBTLVD3244PW |
|
|
文檔 (11)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74CBTLVD3244 | 8-bit level-shifting bus switch with 4-bit output enables | Data sheet | 2024-06-24 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| cbtlvd3244 | 74CBTLVD3244 IBIS model | IBIS model | 2013-06-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| cbtlvd3244 | 74CBTLVD3244 IBIS model | IBIS model | 2013-06-13 |
Ordering, pricing & availability
樣品
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