外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8074-1 | DFN8080-8 | plastic thermal enhanced small outline package; no leads; 8 terminals; body: 8 x 8 x 0.9 mm | MO-229 compatible (JEDEC) | 2023-03-03 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT8074-1 | plastic thermal enhanced small outline package; no leads; 8 terminals; body: 8 x 8 x 0.9 mm | Package information | 2023-03-29 |
| SOT8074-1_332 | DFN8080-8; Reel dry pack for SMD, 13"; Q2/T3 product orientation | Packing information | 2023-04-18 |
采用此封裝的產(chǎn)品
GaN FETs
| 型號(hào) | 描述 | 快速訪問 |
|---|---|---|
| GAN140-650EBE | 650 V, 140 mOhm Gallium Nitride (GaN) FET in a DFN 8?mm?x?8?mm package | |
| GAN080-650EBE | 650 V, 80 mOhm Gallium Nitride (GaN) FET in a DFN 8?mm?x?8?mm package | |
| GAN190-650EBE | 650 V, 190 mOhm Gallium Nitride (GaN) FET in a DFN 8?mm?x?8?mm package |