外形圖
| 封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8063-1 | HSO8 | plastic thermal enhanced small outline package; 8 leads; 1.27 mm pitch; 4.9 mm × 3.9 mm ×1.7 mm body; exposed die pad | MS-012 (JEDEC) | 2024-08-01 |
相關(guān)文檔
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT8063-1 | plastic thermal enhanced small outline package; 8 leads; 1.27 mm pitch;4.9 mm × 3.9 mm ×1.7 mm body; exposed die pad | Package information | 2024-09-24 |
| SOT8063-1_118 | HSO8; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2024-09-19 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| NGD4300DD-Q100 | 4 A peak high-performance dual MOSFET gate driver | |
| NGD4300DD | 4 A peak high-performance dual MOSFET gate driver |