外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8017 | DPAK R2P | Plastic, single-ended surface-mounted package (DPAK R2P); Real-2-Pin configuration; 4.58 mm pitch; 6.16 mm x 6.54 mm x 2.29 mm body | TO-252 (JEDEC) | 2024-01-17 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT8017 | 3D model for products with SOT8017 package | Design support | 2023-03-13 |
| SOT8017 | Plastic, single-ended surface-mounted package (DPAK R2P); Real-2-Pin configuration; 4.58 mm pitch; 6.16 mm x 6.54 mm x 2.29 mm body | Package information | 2024-01-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |