NXU0101
參數(shù)類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXU0101GM | 0.9?-?5.5 | 0.9?-?5.5 | CMOS/LVTTL | ± 12 | 8.1 | 4 | ultra low | -40~125 | 264 | 129 | 5.1 | XSON6 | Uni-directional | Schmitt-trigger |
| NXU0101GS | 0.9?-?5.5 | 0.9?-?5.5 | CMOS/LVTTL | ± 12 | 8.1 | 4 | ultra low | -40~125 | 231 | 128 | 4.7 | XSON6 | Uni-directional | Schmitt-trigger |
| NXU0101GW | 0.9?-?5.5 | 0.9?-?5.5 | CMOS/LVTTL | ± 12 | 8.1 | 4 | ultra low | -40~125 | 177 | 128 | 34 | TSSOP6 | Uni-directional | Schmitt-trigger |
| NXU0101GX | 0.9?-?5.5 | 0.9?-?5.5 | CMOS/LVTTL | ± 12 | 8.1 | 4 | ultra low | -40~125 | 231 | 130 | 4.1 | X2SON6 | Uni-directional | Schmitt-trigger |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXU0101GM | NXU0101GMX (935691958115) |
Active | L1 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| NXU0101GS | NXU0101GSH (935691959125) |
Active | L1 |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暫無信息 |
| NXU0101GW | NXU0101GWH (935691953125) |
Active | L1 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
| NXU0101GX | NXU0101GXZ (935691960147) |
Active | L1 |
X2SON6 (SOT1255-2) |
SOT1255-2 | SOT1255-2_147 |
文檔 (18)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| NXU0101 | 1-bit dual-supply buffer/level translator with Schmitt-trigger; 3-state | Data sheet | 2025-01-28 |
| AN90057 | Pin FMEA for NXU family | Application note | 2024-09-11 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| nxu0101 | NXU0101 IBIS model | IBIS model | 2024-10-31 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| nxu0101 | NXU0101 IBIS model | IBIS model | 2024-10-31 |
樣品
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