74AXP8T245
參數(shù)類型
| 型號(hào) | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AXP8T245BQ | 0.9?-?5.5 | 0.9?-?5.5 | CMOS | ± 12 | 9 | 4 | ultra low | -40~125 | 68 | 6.4 | 42 | DHVQFN24 | Bi-directional | Direction controlled |
| 74AXP8T245PW | 0.9?-?5.5 | 0.9?-?5.5 | CMOS | ± 12 | 9 | 4 | ultra low | -40~125 | 81 | 2.3 | 37 | TSSOP24 | Bi-directional | Direction controlled |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AXP8T245BQ | 74AXP8T245BQJ (935690813118) |
Active | AXP8T245 |
DHVQFN24 (SOT815-1) |
SOT815-1 | SOT815-1_118 | |
| 74AXP8T245PW | 74AXP8T245PWJ (935690812118) |
Active | 4AXP8T245 |
TSSOP24 (SOT355-1) |
SOT355-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT355-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AXP8T245BQ | 74AXP8T245BQJ | 74AXP8T245BQ |
|
|
| 74AXP8T245PW | 74AXP8T245PWJ | 74AXP8T245PW |
|
|
文檔 (10)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AXP8T245 | 8-bit dual supply translating transceiver; 3-state | Data sheet | 2024-07-25 |
| AN90029 | Pin FMEA for AXPnT family | Application note | 2021-07-13 |
| SOT815-1 | 3D model for products with SOT815-1 package | Design support | 2019-10-03 |
| SOT355-1 | 3D model for products with SOT355-1 package | Design support | 2020-01-22 |
| Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN24_SOT815-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 3.5 mm x 5.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | Package information | 2021-08-17 |
| SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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