NXS0101
參數(shù)類型
| 型號(hào) | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXS0101GM | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 4.7 | 1 | low | -40~125 | 253 | 4.5 | 123 | XSON6 | Bi-directional | AutoSense |
| NXS0101GS | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 4.7 | 1 | low | -40~125 | XSON6 | Bi-directional | AutoSense | |||
| NXS0101GW | 1.65?-?3.6 | 2.3?-?5.5 | CMOS | - 0.02 / 1.0 | 4.7 | 1 | low | -40~125 | TSSOP6 | Bi-directional | AutoSense | |||
| NXS0101GW-Q100 | n.a. | CMOS | - 0.02 / 1.0 | 1 | low | -40~125 | TSSOP6 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NXS0101GM | NXS0101GMX (935289722115) |
Active | m1 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| NXS0101GS | NXS0101GSH (935690898125) |
Active | m1 |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暫無(wú)信息 |
| NXS0101GW | NXS0101GWH (935289724125) |
Active | m1 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
| NXS0101GW-Q100 | NXS0101GW-Q100H (935691328125) |
Active | m1 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| NXS0101GM | NXS0101GMX | NXS0101GM |
|
|
| NXS0101GS | NXS0101GSH | NXS0101GS |
|
|
| NXS0101GW | NXS0101GWH | NXS0101GW |
|
|
| NXS0101GW-Q100 | NXS0101GW-Q100H | NXS0101GW-Q100 |
|
|
文檔 (18)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| NXS0101 | Dual supply translating transceiver; open drain; auto?direction?sensing | Data sheet | 2023-11-16 |
| NXS0101_Q100 | Dual supply translating transceiver; open drain; auto?direction?sensing | Data sheet | 2023-11-16 |
| AN90014 | Pin FMEA for NXS family | Application note | 2020-03-25 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| nxs0101 | NXS0101 IBIS model | IBIS model | 2020-11-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
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