參數類型
| 型號 |
|---|
封裝
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBT16211DGG | CBT16211DGG/G,118 (935278906118) |
Obsolete | CBT16211DGG Standard Procedure Standard Procedure |
TSSOP56 (SOT364-1) |
SOT364-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT364-1_118 |
| CBT16211DGG/G,518 (935278906518) |
Obsolete | CBT16211DGG Standard Procedure Standard Procedure | 暫無信息 | ||||
| CBT16211DGG/N,118 (935278404118) |
Obsolete | CBT16211DGG Standard Procedure Standard Procedure | SOT364-1_118 | ||||
| CBT16211DGG,112 (935269707112) |
Obsolete | CBT16211DGG Standard Procedure Standard Procedure | 暫無信息 | ||||
| CBT16211DL | CBT16211DL,512 (935269708512) |
Obsolete | CBT16211DL Standard Procedure Standard Procedure |
SSOP56 (SOT371-1) |
SOT371-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
| CBT16211DL,518 (935269708518) |
Obsolete | CBT16211DL Standard Procedure Standard Procedure | 暫無信息 | ||||
| CBT16211DL,112 (935269708112) |
Obsolete | CBT16211DL Standard Procedure Standard Procedure | 暫無信息 | ||||
| CBT16211DL,118 (935269708118) |
Obsolete | CBT16211DL Standard Procedure Standard Procedure | 暫無信息 |
環(huán)境信息
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBT16211DGG | CBT16211DGG/G,118 | CBT16211DGG |
|
|
| CBT16211DGG | CBT16211DGG/G,518 | CBT16211DGG |
|
|
| CBT16211DGG | CBT16211DGG/N,118 | CBT16211DGG |
|
|
| CBT16211DGG | CBT16211DGG,112 | CBT16211DGG |
|
|
| CBT16211DL | CBT16211DL,512 | CBT16211DL |
|
|
| CBT16211DL | CBT16211DL,518 | CBT16211DL |
|
|
| CBT16211DL | CBT16211DL,112 | CBT16211DL |
|
|
| CBT16211DL | CBT16211DL,118 | CBT16211DL |
|
文檔 (10)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| CBT16211 | 24-bit bus switch with 12-bit output enables | Data sheet | 2001-06-12 |
| sa00510 | Block diagram: CBT16211DGG, CBT16211DL | Block diagram | 2009-11-04 |
| SOT364-1 | 3D model for products with SOT364-1 package | Design support | 2020-01-22 |
| cbt16211 | cbt16211 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT364-1 | plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body | Package information | 2022-06-23 |
| SOT371-1 | plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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