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雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產(chǎn)品(AEC-Q100/Q101)

化學成分 BUK9Y09-40B

作為一家積極進取的可持續(xù)發(fā)展公司,安世半導體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估??蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù),這是安世半導體為半導體產(chǎn)業(yè)設(shè)下的一個行業(yè)標準。安世半導體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934063313115BUK9Y09-40B,115BUK9Y09-40BSOT669 (LFPAK)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 92265 ppm of the article. SCIP No. 73067ae5-0481-41f5-9748-43d9bd18d7c1.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1309-64-4: 4971 ppm; substance 1333-86-4: 745 ppm; substance 7439-92-1: 92265 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 68541-56-0: 5469 ppm; substance 1309-64-4: 4971 ppm; substance 1333-86-4: 745 ppm; substance 7439-92-1: 92265 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 2494 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition.
RHF-2006 indicator E
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-33.700000100.0000004.082533
Die Total3.700000100.0000004.082533
ClipCopper alloyCopper (Cu)7440-50-813.54288099.58000014.943043
ClipCopper alloyChromium (Cr)7440-47-30.0408000.3000000.045018
ClipCopper alloyTitanium (Ti)7440-32-60.0136000.1000000.015006
ClipImpuritySilicon (Si)7440-21-30.0027200.0200000.003002
Clip Total13.600000100.00000015.006069
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000041.749940
Lead FrameCopper alloyIron (Fe)7439-89-60.0568650.1500000.062744
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0151640.0400000.016732
Lead Frame Total37.910000100.00000041.829416
Mould CompoundFillerSilica fused60676-86-016.22160072.00000017.898709
Mould CompoundFillerSilica7631-86-91.4193906.3000001.566137
Mould CompoundPolymerEpoxy resin system1.3518006.0000001.491559
Mould CompoundAdditiveNon-declarable1.3067405.8000001.441841
Mould CompoundPolymerFormaldehyde-phenol copolymer9003-35-41.2166205.4000001.342403
Mould CompoundPolymerFormaldehyde, polymer with bromophenol and 2-(chloromethyl)oxirane68541-56-00.4956602.2000000.546905
Mould CompoundFlame retardantAntimony trioxide (Sb2O3)1309-64-40.4506002.0000000.497186
Mould CompoundPigmentCarbon black1333-86-40.0675900.3000000.074578
Mould Compound Total22.530000100.00000024.859318
Post-PlatingTin alloyTin (Sn)7440-31-53.84961599.9900004.247617
Post-PlatingImpurityNon-declarable0.0003850.0100000.000425
Post-Plating Total3.850000100.0000004.248042
Solder PasteLead alloyLead (Pb)7439-92-18.36200092.5000009.226525
Solder PasteLead alloyTin (Sn)7440-31-50.4520005.0000000.498731
Solder PasteLead alloySilver (Ag)7440-22-40.2260002.5000000.249366
Solder Paste Total9.040000100.0000009.974622
BUK9Y09-40B Total90.630000100.000000
Notes
Report created on 2025-02-01 20:48:12 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-02-01 20:48:12 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
半導體芯片 (Die)??????
夾子 (Clip)??????
引線框架 (Lead Frame)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
錫膏 (Solder Paste)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-02-01 20:48:12 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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