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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車(chē)應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 74HCT373D-Q100

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過(guò)互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶(hù)提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無(wú)鉛狀態(tài)合規(guī)評(píng)估。客戶(hù)可以直接從一般產(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見(jiàn)限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
93529903811874HCT373D-Q100,11874HCT373D-Q100SOT163-1 (SO20)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 11 ppm; substance 7440-02-0: 3279 ppm; substance 1333-86-4: 1484 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 11 ppm; substance 7440-02-0: 3279 ppm; substance 1333-86-4: 1484 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 143 ppm; substance 7440-57-5: 70 ppm; substance 7440-05-3: 126 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.04674077.9000000.008802
AdhesivePolymerAcrylic resin0.00912015.2000000.001717
AdhesivePolymerResin system0.0041406.9000000.000780
Adhesive Total0.060000100.0000000.011299
DieDoped siliconSilicon (Si)7440-21-30.469288100.0000000.088371
Die Total0.469288100.0000000.088371
Lead FrameCopper alloyCopper (Cu)7440-50-8130.81684696.09700024.634094
Lead FrameCopper alloyIron (Fe)7439-89-63.1541322.3170000.593954
Lead FrameCopper alloyZinc (Zn)7440-66-60.1674400.1230000.031531
Lead FrameCopper alloyPhosphorus (P)7723-14-00.1102650.0810000.020764
Lead FrameCopper alloyLead (Pb)7439-92-10.0061260.0045000.001154
Base Alloy Total134.25480998.62250025.281497
Lead FramePure metal layerGold (Au)7440-57-50.0374360.0275000.007049
Pre-Plating 1 Total0.0374360.0275000.007049
Lead FramePure metal layerSilver (Ag)7440-22-40.0292680.0215000.005511
Pre-Plating 2 Total0.0292680.0215000.005511
Lead FramePure metal layerPalladium (Pd)7440-05-30.0667040.0490000.012561
Pre-Plating 3 Total0.0667040.0490000.012561
Lead FramePure metal layerNickel (Ni)7440-02-01.7417831.2795000.327995
Pre-Plating 4 Total1.7417831.2795000.327995
Lead Frame Total136.130000100.00000025.634613
Mould CompoundFillerSilica fused60676-86-0308.78469378.33000058.147183
Mould CompoundPolymerEpoxy resin system34.9348908.8620006.578582
Mould CompoundFlame retardantMagnesium hydroxide (Mg(OH)2)1309-42-824.0468106.1000004.528250
Mould CompoundPolymerPhenolic resin23.2899275.9080004.385721
Mould CompoundFillerSilica7631-86-92.3652600.6000000.445402
Mould CompoundPigmentCarbon black1333-86-40.7884200.2000000.148467
Mould Compound Total394.210000100.00000074.233605
WirePure metalCopper (Cu)7440-50-80.170526100.0000000.032112
Wire Total0.170526100.0000000.032112
74HCT373D-Q100 Total531.039814100.000000
Notes
Report created on 2025-02-01 20:44:07 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
250 °C40 s220 °C30 s3
Notes
Report created on 2025-02-01 20:44:07 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱(chēng)
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價(jià)鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)??????
半導(dǎo)體芯片 (Die)??????
基底合金 (Base Alloy)??????
預(yù)鍍層1 (Pre-Plating 1)??????
預(yù)鍍層2 (Pre-Plating 2)??????
預(yù)鍍層3 (Pre-Plating 3)??????
預(yù)鍍層4 (Pre-Plating 4)??????
模封料 (Mould Compound)??????
導(dǎo)線(xiàn) (Wire)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無(wú)限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2025-02-01 20:44:07 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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